Mipa MP Polishing Sponge Cube 150 mm x 25 mm

The Mipa MP Polishing Sponge Cube is a flexible, soft polishing sponge for the professional finishing and final polishing of painted surfaces. Thanks to its particularly open-pored structure, this polishing pad is highly suitable for achieving a smooth and hologram-free final result.

The special honeycomb structure on the surface ensures better cooling during polishing. This makes the Mipa MP Polishing Sponge Cube ideal for the final steps of the polishing process, where the smoothest possible finish and a deep shine are desired.

The polishing sponge has a diameter of 150 mm, is 25 mm thick, and features a hook-and-loop fastening for quick and easy mounting on a suitable polishing disc.

Main features

• Flexible and soft polishing sponge
• Suitable for finishing and final polishing
• For a hologram-free final result
• Particularly open-pored structure
• Special honeycomb structure
• Better cooling during the polishing process
• Diameter of 150 mm
• Thickness of 25 mm
• Equipped with hook-and-loop fastening
• Suitable for professional damage repair and car paint

Application

The Mipa MP Polishing Sponge Cube was developed for the finishing and final polishing of painted surfaces. The soft structure makes the sponge particularly suitable for the final polishing steps, when fine polishing marks, holograms, and minor imperfections need to be removed from the painted surface.

For the best result, use the polishing sponge in combination with a suitable finishing compound and a suitable polisher and polishing disc.

Use

Securely attach the Mipa MP Polishing Sponge Cube to a suitable polishing disc using the hook-and-loop fastening. Apply a small amount of suitable polishing compound to the sponge and distribute it over the surface to be treated before starting to polish.

Work the surface carefully and check the result periodically. Keep the polishing sponge clean during use to prevent leftover polishing compound and dirt from being redistributed over the painted surface.